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MMSZ3V6T1G - onsemi

Description: 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit

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MMSZ3V6T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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MMSZ3V6T1G - onsemi  - 3D model - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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MMSZ3V6T1G Details

  • Manufacturer Part Number:

    MMSZ3V6T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Package Description:

    SOD-123, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    90 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Reference Voltage-Nom:

    3.6 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

MMSZ3V6T1G Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MMSZ3V6T1G is a rectangular pad with a size of 0.76 mm x 0.76 mm, with a solder mask clearance of 0.15 mm.
  • To handle the ESD sensitivity of the MMSZ3V6T1G, it is recommended to use an ESD protection device, such as a TVS diode, in parallel with the MMSZ3V6T1G. Additionally, follow proper ESD handling procedures during assembly and storage.
  • The maximum operating temperature range for the MMSZ3V6T1G is -40°C to 150°C. However, the device is only guaranteed to meet its electrical specifications within the range of -40°C to 125°C.
  • Yes, the MMSZ3V6T1G is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure high reliability. However, it is recommended to follow proper derating and qualification procedures for the specific application.
  • To ensure the MMSZ3V6T1G is properly soldered, follow the recommended soldering profile, which includes a peak temperature of 260°C and a dwell time of 10-30 seconds. Additionally, ensure the soldering iron is set to the correct temperature and the solder is of high quality.

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MMSZ3V6T1G Overview

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