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MMSZ4688-V-GS08 - Vishay

Description: VISHAY - MMSZ4688-V-GS08. - ZENER DIODE

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PCB Footprints
MMSZ4688-V-GS08 - Vishay PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123-1
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3D Models
MMSZ4688-V-GS08 - Vishay  - 3D model - Small Outline Diode - SOD-123-1
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MMSZ4688-V-GS08 Details

  • Manufacturer Part Number:

    MMSZ4688-V-GS08

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    4.7 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    0.05 mA

MMSZ4688-V-GS08 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MMSZ4688-V-GS08 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.1 mm. It's recommended to follow the IPC-7351 standard for land pattern design.
  • While MMSZ4688-V-GS08 has a maximum operating temperature of 150°C, it's not recommended to use it in high-temperature environments above 125°C for extended periods. Prolonged exposure to high temperatures can affect the device's reliability and lifespan.
  • To prevent damage during assembly, handle the MMSZ4688-V-GS08 by the body, avoid touching the glass diode, and use an anti-static wrist strap or mat. Also, ensure that the assembly process does not subject the device to excessive mechanical stress, such as bending or flexing.
  • The recommended soldering profile for MMSZ4688-V-GS08 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. It's recommended to follow the IPC-J-STD-020 standard for soldering profiles.
  • While MMSZ4688-V-GS08 has a moisture sensitivity level (MSL) of 1, it's still recommended to follow proper handling and storage procedures to prevent moisture absorption. In high-humidity environments, consider using a conformal coating or potting compound to protect the device.

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MMSZ4688-V-GS08 Overview

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For a full list of alternate parts for MMSZ4688-V-GS08, check out Findchips.com