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MMSZ4698T1G - onsemi

Description: 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

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MMSZ4698T1G - onsemi - PCB symbol
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PCB Footprints
MMSZ4698T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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3D Models
MMSZ4698T1G - onsemi - 3D model - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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MMSZ4698T1G Details

  • Manufacturer Part Number:

    MMSZ4698T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Package Description:

    SOD-123, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    11 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    8.4 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    0.05 mA

MMSZ4698T1G Frequently Asked Questions (FAQs)

  • The recommended land pattern for MMSZ4698T1G is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.1 mm. The pad should be centered on the component and have a non-solder-mask-defined (NSMD) pad shape.
  • To handle thermal considerations for MMSZ4698T1G, ensure good thermal conductivity between the device and the PCB by using a thermal via or a thermal pad. Keep the device away from heat sources and ensure good airflow around the device. Also, consider using a heat sink or a thermal interface material (TIM) to improve heat dissipation.
  • The maximum allowable voltage for MMSZ4698T1G is 80 V. Exceeding this voltage may cause permanent damage to the device.
  • To ensure the reliability of MMSZ4698T1G in high-temperature applications, follow the recommended operating temperature range of -55°C to 150°C. Also, ensure that the device is properly soldered and that the PCB is designed to withstand the operating temperature range.
  • The recommended storage condition for MMSZ4698T1G is in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

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MMSZ4698T1G Overview

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