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MMSZ5230BT1G - onsemi

Description: 500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

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MMSZ5230BT1G - onsemi - PCB symbol
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PCB Footprints
MMSZ5230BT1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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MMSZ5230BT1G - onsemi - 3D model - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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MMSZ5230BT1G Details

  • Manufacturer Part Number:

    MMSZ5230BT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    19 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    4.7 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    20 mA

MMSZ5230BT1G Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the MMSZ5230BT1G is -65°C to 150°C.
  • To ensure reliability in high-temperature applications, it is recommended to derate the power dissipation of the MMSZ5230BT1G according to the temperature derating curve provided in the datasheet.
  • The maximum allowable power dissipation for the MMSZ5230BT1G is 500 mW at a junction temperature of 25°C.
  • The MMSZ5230BT1G is a sensitive electronic component and should be handled with care during soldering and assembly. It is recommended to follow the recommended soldering profile and handling procedures to prevent damage to the device.
  • The equivalent circuit model for the MMSZ5230BT1G is a standard diode model with a series resistance and a shunt capacitance. The exact values of these components can be found in the datasheet or by contacting onsemi support.

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MMSZ5230BT1G Overview

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MMSZ5230BT1G Alternates

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Part Image MMSZ5230B-TP-HF Micro Commercial Components

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For a full list of alternate parts for MMSZ5230BT1G, check out Findchips.com