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MMSZ5248B_R1_00001 - PANJIT

Description: Zener Diode 18 V 500 mW ±5% Surface Mount SOD-123

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MMSZ5248B_R1_00001 - PANJIT PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123
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MMSZ5248B_R1_00001 - PANJIT  - 3D model - Small Outline Diode - SOD-123
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MMSZ5248B_R1_00001 Details

  • Manufacturer Part Number:

    MMSZ5248B_R1_00001

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-123, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    PanJit Semiconductor

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    21 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Voltage-Nom:

    18 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    14 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    7 mA

MMSZ5248B_R1_00001 Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for MMSZ5248B_R1_00001 can be found in the PanJit Semiconductor's packaging information document or by contacting their technical support. A general guideline is to use a footprint with a minimum pad size of 0.5mm x 0.5mm and a spacing of 0.5mm between pads.
  • To handle ESD protection when working with MMSZ5248B_R1_00001, follow standard ESD handling procedures, such as using an ESD wrist strap, mat, or workstation, and ensuring that all equipment and tools are properly grounded. Additionally, consider adding external ESD protection devices, such as TVS diodes, to the circuit design.
  • The maximum allowable power dissipation for MMSZ5248B_R1_00001 is dependent on the operating temperature and can be calculated using the thermal resistance and maximum junction temperature specified in the datasheet. As a general guideline, the maximum power dissipation is typically around 500mW to 1W, but this should be verified through thermal analysis and testing.
  • While MMSZ5248B_R1_00001 is a general-purpose Zener diode, it may not meet the specific requirements for high-reliability or automotive applications. Engineers should consult with PanJit Semiconductor's technical support or application notes to determine if the device meets the necessary qualifications and standards for their specific application.
  • To ensure proper soldering and avoid defects, follow standard soldering practices, such as using a soldering iron with a temperature range of 200°C to 250°C, and a solder with a melting point above 180°C. Additionally, use a soldering technique that minimizes thermal stress and ensures good wetting of the solder on the device's leads.

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MMSZ5248B_R1_00001 Overview

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For a full list of alternate parts for MMSZ5248B_R1_00001, check out Findchips.com