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MMSZ5252B-E3-08 - Vishay

Description: Zener Diodes 24 Volt 0.5W 5%

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MMSZ5252B-E3-08 - Vishay - PCB symbol
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PCB Footprints
MMSZ5252B-E3-08 - Vishay PCB footprint - Small Outline Diode - Small Outline Diode - sod-123-ren1
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MMSZ5252B-E3-08 - Vishay - 3D model - Small Outline Diode - sod-123-ren1
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MMSZ5252B-E3-08 Details

  • Manufacturer Part Number:

    MMSZ5252B-E3-08

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-123, 2 PIN

  • Pin Count:

    2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    33 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Voltage-Nom:

    24 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    18 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Voltage Temp Coeff-Max:

    20.88 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5.2 mA

MMSZ5252B-E3-08 Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the MMSZ5252B-E3-08 can be found in the Vishay Intertechnologies' application note AN483, which provides guidelines for surface-mount assembly of diodes and rectifiers.
  • The MMSZ5252B-E3-08 can be soldered using a soldering iron with a temperature of 250°C to 260°C for 1 to 2 seconds. For desoldering, use a desoldering wick or a desoldering pump to remove excess solder. Avoid using excessive heat or force, which can damage the device.
  • The maximum allowable power dissipation for the MMSZ5252B-E3-08 is 500 mW. Exceeding this limit can cause the device to overheat and fail.
  • Yes, the MMSZ5252B-E3-08 is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its high-quality construction and rigorous testing.
  • Store the MMSZ5252B-E3-08 in its original packaging or in a conductive bag to prevent ESD damage. Handle the device by the body, avoiding contact with the leads. Use an ESD wrist strap or mat when handling the device.

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MMSZ5252B-E3-08 Overview

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