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MMSZ5253C-E3-08 - Vishay

Description: Zener Diodes 25 Volt 0.5W 2%

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MMSZ5253C-E3-08 - Vishay - PCB symbol
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PCB Footprints
MMSZ5253C-E3-08 - Vishay PCB footprint - Small Outline Diode - Small Outline Diode - MMSZ5226C-E3-08-1
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MMSZ5253C-E3-08 - Vishay - 3D model - Small Outline Diode - MMSZ5226C-E3-08-1
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MMSZ5253C-E3-08 Details

  • Manufacturer Part Number:

    MMSZ5253C-E3-08

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-123, 2 PIN

  • Pin Count:

    2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    35 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Voltage-Nom:

    25 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    19 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Voltage Temp Coeff-Max:

    22 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

MMSZ5253C-E3-08 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MMSZ5253C-E3-08 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.1 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The MMSZ5253C-E3-08 has a maximum operating temperature of 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated and that the application does not exceed the maximum junction temperature.
  • To prevent damage, handle the MMSZ5253C-E3-08 by the body only, avoiding touching the glass diode. Use an anti-static wrist strap or mat, and ensure the assembly area is free from static electricity. Avoid bending or flexing the leads, and use a soldering iron with a temperature below 260°C.
  • The recommended soldering profile for the MMSZ5253C-E3-08 is a peak temperature of 240°C, with a dwell time of 3-5 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • The MMSZ5253C-E3-08 has a moisture sensitivity level (MSL) of 1, which means it can withstand normal humidity levels. However, it's essential to follow proper storage and handling procedures to prevent moisture absorption. If the device is exposed to high humidity, it's recommended to bake it at 125°C for 24 hours before assembly.

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MMSZ5253C-E3-08 Overview

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