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MMSZ5259B-TP - MCC

Description: • Zener Voltages from 2.4V - 75V • VZ – Tolerance ± 5% • Planar Die Construction • ESD Rating of 16KV per Human Body Model • Halogen Free. “Green” Device (Note 1) • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating • Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS Compliant. See Ordering Information)

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MMSZ5259B-TP - MCC - PCB symbol
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PCB Footprints
MMSZ5259B-TP - MCC PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123-2
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MMSZ5259B-TP - MCC - 3D model - Small Outline Diode - SOD-123-2
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MMSZ5259B-TP Details

  • Manufacturer Part Number:

    MMSZ5259B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    80 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    800 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    39 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Temp Coeff-Max:

    36.66 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    3.2 mA

MMSZ5259B-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for MMSZ5259B-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm. It's also recommended to use a thermal relief pad to prevent thermal stress during reflow soldering.
  • While MMSZ5259B-TP has a maximum operating temperature of 150°C, it's not recommended to use it in high-temperature environments above 125°C for extended periods. Prolonged exposure to high temperatures can affect the device's reliability and lifespan.
  • To prevent electrostatic discharge (ESD) damage, it's essential to handle MMSZ5259B-TP with ESD-safe materials and tools. Ensure that your workspace and equipment are grounded, and use ESD-safe packaging and storage materials.
  • MMSZ5259B-TP should be stored in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid storing the devices in direct sunlight or near heat sources.
  • While MMSZ5259B-TP is not hermetically sealed, it's designed to operate in a humid environment. However, it's essential to follow proper handling and storage procedures to prevent moisture ingress. Avoid exposing the device to condensing humidity or water.

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MMSZ5259B-TP Overview

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