Description:Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant
HALOGEN FREE AND ROHS COMPLIANT, 318-08, TO-236, 3 PIN
Pin Count:
3
Manufacturer Package Code:
318
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Manufacturer:
onsemi
YTEOL:
7
Additional Feature:
BUILT IN BIAS RESISTANCE RATIO IS 1
Collector Current-Max (IC):
0.1 A
Collector-Emitter Voltage-Max:
50 V
Configuration:
SINGLE WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE):
80
JEDEC-95 Code:
TO-236AB
JESD-30 Code:
R-PDSO-G3
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
PNP
Power Dissipation-Max (Abs):
0.4 W
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
VCEsat-Max:
0.25 V
MMUN2136LT1G Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the package and to connect it to a thermal plane or a heat sink.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink, thermal interface material, and ensuring good airflow around the device.
The MMUN2136LT1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. This includes using an ESD wrist strap, ESD mat, and ESD-protected packaging.
Yes, the MMUN2136LT1G is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and to ensure that the device is properly qualified and validated for the specific application.
The recommended soldering conditions for the MMUN2136LT1G include a peak temperature of 260°C, a soldering time of 10 seconds or less, and a soldering method that follows the IPC J-STD-020 standard.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
MMUN2136LT1G Overview
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