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MMZ2012Y150BTD25 - TDK

Description: Ferrite Beads 0805 15ohms 1500mA Signal Line AEC-Q200

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MMZ2012Y150BTD25 - TDK - PCB symbol
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PCB Footprints
MMZ2012Y150BTD25 - TDK PCB footprint - Ferrite Bead Chip - Ferrite Bead Chip - MMZ2012
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3D Models
MMZ2012Y150BTD25 - TDK - 3D model - Ferrite Bead Chip - MMZ2012
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MMZ2012Y150BTD25 Details

  • Manufacturer Part Number:

    MMZ2012Y150BTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    EIA STD PACKAGE SIZE 0805, SMD, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Additional Feature:

    AEC-Q200

  • Construction:

    Chip Bead

  • DC Resistance-Max:

    0.05 Ω

  • Filter Type:

    FERRITE CHIP

  • Height:

    0.85 mm

  • Length:

    2 mm

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Impedance:

    15 OHM Ω

  • Packing Method:

    TR, 7 INCH

  • Rated Current:

    1.5 A

  • Screening Level:

    AEC-Q200

  • Width:

    1.25 mm

MMZ2012Y150BTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MMZ2012Y150BTD25 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While MMZ2012Y150BTD25 is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the component's reliability and lifespan may be affected by prolonged exposure to high temperatures.
  • MMZ2012Y150BTD25 is a moisture-sensitive device. To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry environment (less than 30% RH) and using a dry pack or desiccant when storing for extended periods.
  • The recommended soldering profile for MMZ2012Y150BTD25 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow a controlled soldering process to prevent damage to the component.
  • While MMZ2012Y150BTD25 is designed to be robust, it's essential to consider the component's mechanical stress limits. In high-vibration or high-shock applications, it's recommended to use additional mechanical support or potting to ensure the component's reliability and prevent mechanical failure.

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MMZ2012Y150BTD25 Overview

Use the download button to access the MMZ2012Y150BTD25 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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