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MOCD208R2M - onsemi

Description: Minimum BVCEO of 30 V Guaranteed; MOCD207M, MOCD208M; Convenient Plastic SOIC-8 Surface Mountable Package Style, with 0.050" Lead Spacing; MOCD211M, MOCD213M, MOCD217M; DIN-EN/IEC60747-5-5, 565 V Peak Working Insulation Voltage; MOCD217M; Low LED Input Current Required for Easier Logic Interfacing; Closely Matched Current Transfer Ratios; Minimum BVCEO of 70 V Guaranteed; Safety and Regulatory Approvals:; UL1577, 2,500 VACRMS for 1 Minute

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MOCD208R2M - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8_2024
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MOCD208R2M - onsemi  - 3D model - Small Outline Packages - SOIC8_2024
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MOCD208R2M Details

  • Manufacturer Part Number:

    MOCD208R2M

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751DZ

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    70 V

  • Configuration:

    SEPARATE, 2 CHANNELS

  • Current Transfer Ratio-Min:

    13%

  • Current Transfer Ratio-Nom:

    40%

  • Dark Current-Max:

    50 nA

  • Forward Current-Max:

    0.06 A

  • Forward Voltage-Max:

    1.55 V

  • Isolation Voltage-Max:

    2500 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    2

  • On-State Current-Max:

    0.15 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TR

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.0000032 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

MOCD208R2M Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to allow heat to escape.
  • Ensure the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement proper thermal management, such as heat sinks or fans, to maintain a safe operating temperature. Monitor the device's thermal status using the thermal monitoring pin (if available).
  • The MOCD208R2M has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure the PCB is properly grounded. Avoid touching the device's pins or exposing it to static electricity.
  • Yes, the MOCD208R2M is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101, a standard for automotive-grade semiconductor components. However, ensure you follow the recommended operating conditions, and consult with onsemi's application engineers for specific guidance.
  • Consult the onsemi application note for troubleshooting guidelines. Check the device's operating conditions, power supply, and PCB layout. Verify that the device is properly soldered and that there are no signs of physical damage. If issues persist, contact onsemi's technical support for further assistance.

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MOCD208R2M Overview

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