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MOCD211R2M - onsemi

Description: Closely Matched Current Transfer Ratios; MOCD217M; Minimum BVCEO of 70 V Guaranteed; Minimum BVCEO of 30 V Guaranteed; DIN-EN/IEC60747-5-5, 565 V Peak Working Insulation Voltage; UL1577, 2,500 VACRMS for 1 Minute; Safety and Regulatory Approvals:; MOCD207M, MOCD208M; MOCD211M, MOCD213M, MOCD217M; Convenient Plastic SOIC-8 Surface Mountable Package Style, with 0.050" Lead Spacing; Low LED Input Current Required for Easier Logic Interfacing

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MOCD211R2M - onsemi - PCB symbol
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PCB Footprints
MOCD211R2M - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8 CASE 751DZ ISSUE O
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MOCD211R2M - onsemi - 3D model - Small Outline Packages - SOIC8 CASE 751DZ ISSUE O
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MOCD211R2M Details

  • Manufacturer Part Number:

    MOCD211R2M

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751DZ

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    30 V

  • Configuration:

    SEPARATE, 2 CHANNELS

  • Current Transfer Ratio-Min:

    20%

  • Current Transfer Ratio-Nom:

    20%

  • Dark Current-Max:

    50 nA

  • Forward Current-Max:

    0.06 A

  • Forward Voltage-Max:

    1.5 V

  • Isolation Voltage-Max:

    2500 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    2

  • On-State Current-Max:

    0.15 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TR

  • Power Dissipation-Max:

    0.25 W

  • Response Time-Max:

    0.0000032 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

MOCD211R2M Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's current handling capability at high temperatures.
  • A soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds is recommended. The device should be soldered using a no-clean or water-soluble flux.
  • Handle the device in an ESD-protected environment. Use ESD-protective packaging and wrist straps. Ground all equipment and tools to prevent static buildup. Avoid touching the device's pins or handling it in a way that could generate static electricity.
  • Store the device in its original packaging or in a dry, ESD-protected environment. Avoid exposing the device to moisture, direct sunlight, or extreme temperatures. Handle the device by the body, not the leads, to prevent damage.

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MOCD211R2M Overview

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