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MOCD217R2VM - onsemi

Description: DIN-EN/IEC60747-5-5, 565 V Peak Working Insulation Voltage; Closely Matched Current Transfer Ratios; MOCD217M; MOCD207M, MOCD208M; UL1577, 2,500 VACRMS for 1 Minute; Safety and Regulatory Approvals:; Minimum BVCEO of 30 V Guaranteed; MOCD211M, MOCD213M, MOCD217M; Minimum BVCEO of 70 V Guaranteed; Low LED Input Current Required for Easier Logic Interfacing; Convenient Plastic SOIC-8 Surface Mountable Package Style, with 0.050" Lead Spacing

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MOCD217R2VM - onsemi - PCB symbol
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PCB Footprints
MOCD217R2VM - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8 CASE 751DZ ISSUE O
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3D Models
MOCD217R2VM - onsemi - 3D model - Small Outline Packages - SOIC8 CASE 751DZ ISSUE O
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MOCD217R2VM Details

  • Manufacturer Part Number:

    MOCD217R2VM

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751DZ

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    UL RECOGNIZED, VDE APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    30 V

  • Configuration:

    SEPARATE, 2 CHANNELS

  • Current Transfer Ratio-Min:

    100%

  • Current Transfer Ratio-Nom:

    130%

  • Dark Current-Max:

    50 nA

  • Forward Current-Max:

    0.06 A

  • Forward Voltage-Max:

    1.3 V

  • Isolation Voltage-Max:

    2500 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    2

  • On-State Current-Max:

    0.15 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TR

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.0000032 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

MOCD217R2VM Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a heat sink or thermal interface material, and ensure good airflow. Consider derating the device's current handling capability based on the ambient temperature.
  • Handle the device in an ESD-protected environment, and use wrist straps or mats. Avoid touching the device's pins or leads, and use anti-static packaging during storage and transportation.
  • Yes, but ensure compliance with relevant industry standards (e.g., AEC-Q101 for automotive). Consult onsemi's reliability report and perform thorough testing and validation.
  • Use a logic analyzer or oscilloscope to monitor the device's inputs and outputs. Check for proper power supply, signal integrity, and thermal management. Consult onsemi's application notes and technical support resources.

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MOCD217R2VM Overview

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