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MP4561DQ-LF-P - Monolithic Power Systems (MPS)

Description: Switching Voltage Regulators 1.5A, 2MHz, 55V Step-Down Converter

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PCB Footprints
MP4561DQ-LF-P - Monolithic Power Systems (MPS) PCB footprint - Small Outline No-lead - Small Outline No-lead - 3mm x 3mm QFN10 (EXPOSED PAD)
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3D Models
MP4561DQ-LF-P - Monolithic Power Systems (MPS)  - 3D model - Small Outline No-lead - 3mm x 3mm QFN10 (EXPOSED PAD)
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MP4561DQ-LF-P Details

  • Manufacturer Part Number:

    MP4561DQ-LF-P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    QFN-10

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Monolithic Power Systems

  • YTEOL:

    3

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    55 V

  • Input Voltage-Min:

    3.8 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-XDSO-N10

  • Length:

    3 mm

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.5 A

  • Output Voltage-Max:

    52 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1300 kHz

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

MP4561DQ-LF-P Frequently Asked Questions (FAQs)

  • A good PCB layout for the MP4561DQ-LF-P should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure that the thermal vias are connected to a solid copper plane on the bottom layer. Keep the input and output capacitors close to the device to minimize parasitic inductance.
  • To optimize the compensation network, start by following the datasheet's recommended values. Then, use simulation tools or empirical methods to fine-tune the network. Pay attention to the crossover frequency, phase margin, and gain margin to ensure stability across the operating range.
  • While the datasheet specifies a maximum input voltage, it's essential to consider the input voltage ripple as well. A general rule of thumb is to keep the input voltage ripple below 10% of the nominal input voltage to ensure reliable operation and prevent damage to the device.
  • While ceramic capacitors are suitable for many applications, they might not be the best choice for the output filter capacitor (COUT) in the MP4561DQ-LF-P. Ceramic capacitors can exhibit significant voltage coefficient and temperature dependence, which may affect the output voltage regulation. Instead, consider using a low-ESR electrolytic or polymer capacitor for COUT.
  • To ensure EMI compliance, follow proper PCB layout practices, such as separating the input and output stages, using a solid ground plane, and minimizing loop areas. Additionally, consider adding EMI filters, such as common-mode chokes or ferrite beads, to the input and output lines. Shielding and enclosure design can also help reduce EMI emissions.

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MP4561DQ-LF-P Overview

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