REQUIRED HIGH VOLT STARTUP CKT SUPPLY OF 10V TO 100V; OUTPUT VOLT IS ADJ FROM -0.5V TO 150V
Analog IC - Other Type:
SWITCHING REGULATOR
Control Mode:
CURRENT-MODE
Control Technique:
PULSE WIDTH MODULATION
Input Voltage-Max:
6 V
Input Voltage-Min:
4.5 V
Input Voltage-Nom:
5 V
JESD-30 Code:
R-PDSO-G8
Length:
4.9 mm
Number of Functions:
1
Number of Terminals:
8
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
HLSOP
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
Seated Height-Max:
1.7 mm
Surface Mount:
YES
Switcher Configuration:
BOOST
Switching Frequency-Max:
500 kHz
Temperature Grade:
INDUSTRIAL
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Width:
3.9 mm
MP6002DN-LF-Z Frequently Asked Questions (FAQs)
A good PCB layout is crucial for the MP6002DN-LF-Z. It's recommended to follow a 4-layer stack-up with a solid ground plane, and to keep the input and output capacitors close to the IC. Additionally, the feedback network should be placed close to the FB pin to minimize noise.
To ensure stability, it's essential to follow the recommended component values and PCB layout. Additionally, the output capacitor's ESR should be within the recommended range, and the feedback network should be properly compensated. A stability analysis can be performed using the provided SPICE model.
The MP6002DN-LF-Z can withstand a maximum input voltage of 24V, but it's recommended to operate within the specified input voltage range of 4.5V to 18V for optimal performance and reliability.
The output voltage ripple and noise can be calculated using the provided equations in the datasheet. The output voltage ripple is primarily dependent on the output capacitor's value and ESR, while the noise is dependent on the switching frequency and output capacitor's value.
For high-power applications, it's essential to ensure proper thermal management. A heat sink or thermal pad can be used to dissipate heat, and the device should be mounted on a multi-layer PCB with a solid ground plane to improve thermal conductivity.
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MP6002DN-LF-Z Overview
Use the download button to access the MP6002DN-LF-Z schematic symbol, PCB footprint, and 3D model.
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