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MP8675DN-LF-Z - Monolithic Power Systems (MPS)

Description: 6A, 42V, 420kHz Step-Down Converter with Synchronizable Gate Driver

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MP8675DN-LF-Z - Monolithic Power Systems (MPS) PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8E (EP)
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MP8675DN-LF-Z - Monolithic Power Systems (MPS)  - 3D model - Small Outline Packages - SOIC8E (EP)
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MP8675DN-LF-Z Details

  • Manufacturer Part Number:

    MP8675DN-LF-Z

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Monolithic Power Systems

  • YTEOL:

    7.7

  • Additional Feature:

    OUTPUT VOLTAGE IS ADJUSTABLE FROM 0.8V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    600 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

MP8675DN-LF-Z Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane, using thermal vias to connect the exposed pad to the ground plane, and keeping the thermal path as short as possible.
  • To optimize the output voltage accuracy, ensure that the input voltage is within the recommended range, use a high-precision resistor divider for the feedback network, and minimize the noise on the FB pin by using a low-pass filter or a capacitor to ground.
  • The maximum capacitive load that the MP8675DN-LF-Z can drive is 10uF, but it's recommended to derate the capacitance value based on the output voltage and frequency to ensure stability.
  • To prevent oscillations or instability in the output voltage, ensure that the output capacitor is properly sized and placed close to the device, use a low-ESR capacitor, and add a small series resistor (e.g., 1-2 ohms) to the output capacitor to dampen the ringing.
  • The recommended input capacitor value is 10uF to 22uF, and it's recommended to use a low-ESR ceramic capacitor (e.g., X5R or X7R) with a voltage rating of at least 2x the input voltage.

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MP8675DN-LF-Z Overview

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