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MP8771GQ-Z - Monolithic Power Systems (MPS)

Description: IC REG 17V 10A HI EFFICIEN 700KH

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MP8771GQ-Z - Monolithic Power Systems (MPS) PCB footprint - Other - Other - MP8771GQ-Z-4
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3D Models
MP8771GQ-Z - Monolithic Power Systems (MPS)  - 3D model - Other - MP8771GQ-Z-4
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MP8771GQ-Z Details

  • Manufacturer Part Number:

    MP8771GQ-Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-16

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    28 Weeks

  • Manufacturer:

    Monolithic Power Systems

  • YTEOL:

    7.7

  • Additional Feature:

    ALSO HAS PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    12 V

  • Output Voltage-Min:

    0.6 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    0.15 mA

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    800 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MP8771GQ-Z Frequently Asked Questions (FAQs)

  • A good thermal design should be used to minimize thermal resistance. A 2-layer or 4-layer PCB with a solid ground plane is recommended. The thermal pad should be connected to a large copper area to dissipate heat efficiently.
  • To ensure stability, a minimum ESR of 10mΩ is recommended for the output capacitor. Additionally, the output capacitor should be placed close to the IC, and the feedback network should be designed to minimize noise and oscillations.
  • The maximum input voltage rating is 24V, but it's recommended to operate the device within the specified input voltage range of 4.5V to 18V for optimal performance and reliability.
  • The output voltage ripple and noise can be calculated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the input capacitor, placed close to the IC to minimize noise and ripple.

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