A good PCB layout for the MP8794GLE-Z should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure that the thermal vias are connected to a solid copper plane on the bottom layer. Keep the input and output capacitors close to the device to minimize parasitic inductance.
To optimize output voltage accuracy, use a high-precision resistor divider network for the feedback resistors (RFBT and RFBG). Ensure that the resistors have a low temperature coefficient and are placed close to the device to minimize noise and thermal gradients.
A low-ESR ceramic capacitor (X5R or X7R dielectric) with a value between 4.7uF to 10uF is recommended for the input capacitor (CIN). This helps to filter out high-frequency noise and ensure stable operation.
To prevent oscillations and ringing, ensure that the output capacitor (COUT) has a low ESR and is placed close to the device. Use a capacitor with a value between 10uF to 22uF and a low-ESR type (e.g., X5R or X7R dielectric). Additionally, add a small series resistor (RS) between the output capacitor and the output pin to dampen any oscillations.
The MP8794GLE-Z can tolerate an input voltage ripple of up to 10% of the nominal input voltage. However, it's recommended to keep the input voltage ripple below 5% to ensure stable operation and optimal performance.
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MP8794GLE-Z Overview
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