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MP8854GL-Z - Monolithic Power Systems (MPS)

Description: - Tape and Reel

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PCB Footprints
MP8854GL-Z - Monolithic Power Systems (MPS) PCB footprint - Other - Other - MP8854GL-Z-2
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3D Models
MP8854GL-Z - Monolithic Power Systems (MPS)  - 3D model - Other - MP8854GL-Z-2
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MP8854GL-Z Details

  • Manufacturer Part Number:

    MP8854GL-Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-14

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    28 Weeks

  • Date Of Intro:

    2019-12-01

  • Manufacturer:

    Monolithic Power Systems

  • YTEOL:

    7.6

  • Additional Feature:

    ALSO HAS PWM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE FREQUENCY MODULATION

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    2.85 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-XQCC-N14

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    5.5 V

  • Output Voltage-Min:

    0.6 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC14,.12X.16(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    0.6 mA

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    600 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MP8854GL-Z Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides a recommended PCB layout, but it's essential to consult with a thermal expert or perform thermal simulations to ensure optimal performance.
  • To ensure the device operates within the recommended operating conditions, monitor the input voltage, output voltage, and output current. Implement overvoltage protection, undervoltage protection, and overcurrent protection to prevent damage to the device. Also, ensure the device is operated within the recommended temperature range.
  • Exceeding the maximum ratings can lead to device failure, reduced lifespan, or even catastrophic failure. It's essential to operate the device within the recommended specifications to ensure reliable operation and prevent damage.
  • To troubleshoot issues with the device, start by checking the input voltage, output voltage, and output current. Verify that the device is operated within the recommended specifications. Check for any signs of overheating, and ensure the device is properly soldered and connected. Consult the datasheet and application notes for troubleshooting guidelines.
  • To minimize EMI and EMC issues, ensure proper PCB layout, use a good ground plane, and implement EMI filters or shielding if necessary. Follow the recommended layout and grounding guidelines in the datasheet and application notes.

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MP8854GL-Z Overview

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