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MPF050T-FCSG325E - Microchip

Description: FPGA - Field Programmable Gate Array PolarFire Mid-Range FPGA, 48KLEs

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MPF050T-FCSG325E - Microchip - PCB symbol
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PCB Footprints
MPF050T-FCSG325E - Microchip PCB footprint - BGA - BGA - 325-BALL BGA
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MPF050T-FCSG325E - Microchip - 3D model - BGA - 325-BALL BGA
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MPF050T-FCSG325E Details

  • Manufacturer Part Number:

    MPF050T-FCSG325E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-325

  • Pin Count:

    325

  • Manufacturer Package Code:

    TFBGA-325

  • Country Of Origin:

    South Korea

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Additional Feature:

    IT ALSO OPERATES AT 1.05 NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B325

  • JESD-609 Code:

    e1

  • Length:

    11 mm

  • Number of Inputs:

    164

  • Number of Logic Cells:

    48000

  • Number of Outputs:

    164

  • Number of Terminals:

    325

  • Operating Temperature-Max:

    100 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA325,21X21,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    11 mm

MPF050T-FCSG325E Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the device's evaluation board documentation, which includes thermal vias and heat sinks to ensure optimal thermal performance. It's recommended to follow this layout to minimize thermal resistance and ensure reliable operation.
  • The input capacitor selection depends on the input voltage, output voltage, and output current requirements. A general guideline is to choose a capacitor with a voltage rating of at least 1.5 times the input voltage, and a capacitance value that ensures the device's input voltage ripple is within the specified limits. Microchip provides a capacitor selection guide in the device's application note.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, the maximum ambient temperature for reliable operation depends on the specific application and cooling conditions. As a general guideline, it's recommended to keep the ambient temperature below 85°C to ensure reliable operation and minimize the risk of thermal shutdown.
  • To ensure EMC compliance, it's recommended to follow Microchip's guidelines for PCB layout, component selection, and shielding. Additionally, the device's switching frequency and output voltage should be considered when designing the system's EMC filters and shielding. Microchip provides EMC design guidelines in the device's application note.
  • Microchip recommends a soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a ramp rate of 3°C/second. It's essential to follow this profile to prevent damage to the device and ensure reliable operation.

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MPF050T-FCSG325E Overview

Use the download button to access the MPF050T-FCSG325E schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MPF05, or try a keyword search, such as Field Programmable Gate Arrays

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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