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MPF050T-FCVG484I - Microchip

Description: Field Programmable Gate Array (FPGA) IC 176 3774874 484-BFBGA,0.97V ~ 1.08V,-40°C ~ 100°C (TJ)

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MPF050T-FCVG484I - Microchip - PCB symbol
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PCB Footprints
MPF050T-FCVG484I - Microchip PCB footprint - BGA - BGA - FCVG484_2025
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MPF050T-FCVG484I - Microchip - 3D model - BGA - FCVG484_2025
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MPF050T-FCVG484I Details

  • Manufacturer Part Number:

    MPF050T-FCVG484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-484

  • Pin Count:

    484

  • Manufacturer Package Code:

    BGA-484

  • Country Of Origin:

    South Korea

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Additional Feature:

    IT ALSO OPERATES AT 1.05 NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Number of Inputs:

    176

  • Number of Logic Cells:

    48000

  • Number of Outputs:

    176

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.32 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

MPF050T-FCVG484I Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout guide in their application note AN1205, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure optimal performance.
  • The power-up sequence should follow the recommended sequence in the datasheet, with the core voltage (VCC) powered up first, followed by the input/output voltage (VIO), and then the clock signal. This ensures proper device initialization and prevents latch-up or other issues.
  • The MPF050T-FCVG484I is rated for operation from -40°C to +125°C, but it's essential to consider the specific use case and potential thermal gradients on the PCB to ensure reliable operation within the specified temperature range.
  • Microchip recommends following the ESD protection guidelines in their application note AN141, which includes information on handling, storage, and PCB design considerations to prevent electrostatic discharge damage.
  • Microchip recommends using decoupling capacitors with values between 0.01 μF and 0.1 μF, placed as close as possible to the power pins of the device. The exact values and placement will depend on the specific application and PCB layout.

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MPF050T-FCVG484I Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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