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MPF100T-1FCSG325I - Microchip

Description: MICROCHIP - MPF100T-1FCSG325I - FPGA, PolarFire, DLL, PLL, 170 I/O's, 500 MHz, 109000 Cells, 970 mV to 1.08 V, FCBGA-325

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PCB Footprints
MPF100T-1FCSG325I - Microchip PCB footprint - BGA - BGA - 325-BALL BGA_2024
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3D Models
MPF100T-1FCSG325I - Microchip  - 3D model - BGA - 325-BALL BGA_2024
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MPF100T-1FCSG325I Details

  • Manufacturer Part Number:

    MPF100T-1FCSG325I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-325

  • Pin Count:

    325

  • Manufacturer Package Code:

    TFBGA-325

  • Country Of Origin:

    South Korea

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Additional Feature:

    IT ALSO OPERATES AT 1.05 NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B325

  • JESD-609 Code:

    e1

  • Length:

    11 mm

  • Number of Inputs:

    170

  • Number of Outputs:

    170

  • Number of Terminals:

    325

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA325,21X21,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    11 mm

MPF100T-1FCSG325I Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Decoupling capacitors should be placed close to the device, and signal traces should be kept short and away from noise sources.
  • Use a common clock source, ensure proper termination, and follow the I2C bus specification for clock stretching and arbitration. Also, use a bus buffer or repeater if the bus is long or has multiple branches.
  • The MPF100T-1FCSG325I is rated for operation from -40°C to +125°C, but the actual operating temperature range may be limited by the specific application and PCB design.
  • Use an external power-on reset circuit or a dedicated reset IC to ensure a clean power-up sequence. For brown-out detection, use a voltage supervisor IC or a dedicated brown-out detection circuit.
  • The MPF100T-1FCSG325I has built-in ESD protection, but additional protection may be required depending on the application and environment. Follow the IEC 61000-4-2 standard for ESD testing and protection.

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MPF100T-1FCSG325I Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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