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MPLAD30KP36CAE3 - Microchip

Description: Surface Mount 30,000 Watt Transient Voltage Suppressor

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MPLAD30KP36CAE3 - Microchip PCB footprint - Other - Other - PLAD_2023
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MPLAD30KP36CAE3 - Microchip  - 3D model - Other - PLAD_2023
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MPLAD30KP36CAE3 Details

  • Manufacturer Part Number:

    MPLAD30KP36CAE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    30 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    44.2 V

  • Breakdown Voltage-Min:

    40 V

  • Breakdown Voltage-Nom:

    42.1 V

  • Case Connection:

    CATHODE

  • Clamping Voltage-Max:

    58.1 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    S-PSSO-G1

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    30000 W

  • Number of Elements:

    1

  • Number of Terminals:

    1

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    2.5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    MIL-19500

  • Rep Pk Reverse Voltage-Max:

    36 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

MPLAD30KP36CAE3 Frequently Asked Questions (FAQs)

  • Microchip recommends following the PCB layout guidelines provided in the application note AN954, which includes recommendations for pad layout, thermal vias, and decoupling capacitors to ensure optimal performance and thermal management.
  • The selection of external components such as capacitors, resistors, and inductors depends on the specific application and operating conditions. Microchip provides a component selection guide in the datasheet, and additional guidance can be found in the application notes and design guides available on the Microchip website.
  • The MPLAD30KP36CAE3 has a high power density, and thermal management is critical to ensure reliable operation. Microchip recommends using a heat sink, thermal interface material, and following the thermal design guidelines provided in the datasheet and application notes to keep the junction temperature within the recommended operating range.
  • Microchip provides troubleshooting guidelines in the datasheet and application notes, which include steps to identify and resolve common issues such as overvoltage or undervoltage faults, overcurrent faults, and thermal shutdowns. Additionally, Microchip's technical support team can provide further assistance and guidance.
  • The MPLAD30KP36CAE3 is a high-frequency device, and EMI and EMC considerations are critical to ensure compliance with regulatory requirements. Microchip recommends following the EMI and EMC guidelines provided in the datasheet and application notes, which include recommendations for PCB layout, shielding, and filtering to minimize electromagnetic interference.

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MPLAD30KP36CAE3 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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