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MPLAD36KP33A - Microsemi Corporation

Description: ESD Suppressors / TVS Diodes 36kW Uni-Directional -55C to 150C

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MPLAD36KP33A - Microsemi Corporation PCB footprint - Other - Other - MPLAD18KP160CA-2
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MPLAD36KP33A - Microsemi Corporation  - 3D model - Other - MPLAD18KP160CA-2
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MPLAD36KP33A Details

  • Manufacturer Part Number:

    MPLAD36KP33A

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Transferred

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • JESD-609 Code:

    e0

  • Moisture Sensitivity Level:

    1

  • Terminal Finish:

    TIN LEAD

MPLAD36KP33A Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Microsemi's guidelines for PCB layout and thermal management. This includes using a 4-layer PCB with a solid ground plane, placing thermal vias under the device, and using a heat sink with a thermal interface material. Additionally, ensure that the PCB is designed to minimize thermal resistance and maximize heat dissipation.
  • Microsemi provides radiation-hardened and SEE-mitigated versions of the MPLAD36KP33A. To implement radiation hardening and SEE mitigation, follow Microsemi's guidelines for designing radiation-tolerant systems, including using triple modular redundancy, error correction codes, and latch-up protection. Additionally, consider using radiation-hardened components and following best practices for radiation-hardened design.
  • When using the MPLAD36KP33A in high-reliability applications, consider the limitations of the device, such as its total dose radiation tolerance, single-event upset (SEU) sensitivity, and latch-up immunity. Ensure that your design meets the required reliability standards, and consider using redundancy, error correction, and fault tolerance mechanisms to mitigate potential failures.
  • To ensure EMI and EMC compliance, follow Microsemi's guidelines for designing EMI-resistant and EMC-compliant systems. This includes using proper shielding, filtering, and grounding techniques, as well as following best practices for PCB layout and component selection. Additionally, consider using EMI-absorbing materials and conducting EMI and EMC testing to validate your design.
  • To ensure the MPLAD36KP33A meets your specific application requirements, follow Microsemi's recommended testing and validation procedures, including functional testing, environmental testing, and radiation testing. Additionally, consider conducting application-specific testing, such as testing for SEU, single-event latch-up (SEL), and total ionizing dose (TID) effects.

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MPLAD36KP33A Overview

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