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MPM3606GQV-Z - Monolithic Power Systems (MPS)

Description: DC DC CONVERTER 4.5-21V 0.6A

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PCB Footprints
MPM3606GQV-Z - Monolithic Power Systems (MPS) PCB footprint - Other - Other - QFN-20 (3mmx5mmx1.6mm)_2020
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3D Models
MPM3606GQV-Z - Monolithic Power Systems (MPS)  - 3D model - Other - QFN-20 (3mmx5mmx1.6mm)_2020
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MPM3606GQV-Z Details

  • Manufacturer Part Number:

    MPM3606GQV-Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-20

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Monolithic Power Systems

  • YTEOL:

    8.2

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    21 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-XXMA-N20

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    5.5 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    XMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.65 mm

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2500 kHz

  • Technology:

    HYBRID

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    UNSPECIFIED

  • Width:

    3 mm

MPM3606GQV-Z Frequently Asked Questions (FAQs)

  • A good PCB layout for the MPM3606GQV-Z should prioritize thermal management, minimize noise, and ensure good power and ground plane connections. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended. Place the IC near the input capacitors and ensure a short, direct path for the output voltage.
  • Choose input capacitors with low ESR (Equivalent Series Resistance) and high ripple current rating to minimize voltage ripple and ensure stable operation. Output capacitors should have low ESR and be rated for the output voltage and current. A good starting point is to use 10uF to 22uF ceramic capacitors for both input and output.
  • The MPM3606GQV-Z has a thermal pad that should be connected to a solid ground plane or a thermal relief pattern on the PCB. Ensure good airflow around the IC and consider using a heat sink or thermal interface material if the device will be operating at high temperatures or high power levels.
  • Ensure that the input voltage rises monotonically during start-up and falls monotonically during shutdown. Use a soft-start circuit or a voltage supervisor to control the input voltage and prevent unwanted oscillations or voltage spikes.
  • Use a shielded inductor and place it away from sensitive circuits. Ensure good decoupling of the input and output capacitors and use a common-mode choke or ferrite bead to reduce EMI. Keep the PCB layout compact and avoid long traces that can act as antennas.

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MPM3606GQV-Z Overview

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