Bivar recommends a thermal pad on the bottom of the device, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Bivar recommends using a soldering temperature of 250°C (max) and a soldering time of 3 seconds (max) to prevent damage to the device. A soldering iron with a temperature control is recommended.
The maximum allowable voltage drop across the MPR5GT is 2.5V. Exceeding this voltage drop may lead to reduced performance, increased power consumption, or even device failure.
The MPR5GT is not designed for use in high-humidity environments. If operation in humid environments is required, consider using a conformal coating or potting the device to protect it from moisture.
Bivar recommends using ESD-safe handling procedures, such as wearing an ESD wrist strap or using an ESD mat, to prevent damage to the device from electrostatic discharge.
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MPR5GT Overview
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