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MR25H40MDFR - Everspin Technologies

Description: NVRAM 4Mb 3.3V 512Kx8 SPI Pre-Qual Sample MRAM

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MR25H40MDFR - Everspin Technologies PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN Small Flag Package
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MR25H40MDFR - Everspin Technologies  - 3D model - Small Outline No-lead - DFN Small Flag Package
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MR25H40MDFR Details

  • Manufacturer Part Number:

    MR25H40MDFR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SON

  • Package Description:

    DFN-8

  • Pin Count:

    8

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    EAR99

  • Manufacturer:

    Everspin Technologies

  • YTEOL:

    6

  • Clock Frequency-Max (fCLK):

    40 MHz

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    6 mm

  • Memory Density:

    4194304 bit

  • Memory IC Type:

    MRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Serial Bus Type:

    SPI

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    5 mm

MR25H40MDFR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MR25H40MDFR is -40°C to 125°C.
  • To ensure data integrity during power cycling, it is recommended to use a voltage supervisor or a power-on reset circuit to ensure that the device is properly initialized before accessing the memory.
  • The recommended storage condition for the MR25H40MDFR is in a dry, cool place, away from direct sunlight, with a relative humidity of 60% or less, and a temperature range of -40°C to 125°C.
  • The MR25H40MDFR is not designed to operate in radiation-intensive environments. If you need a radiation-hardened device, you should consider a different product.
  • In the event of a write error, the device will set the error flag. You should implement error handling mechanisms, such as retrying the write operation or using error correction codes, to ensure data integrity.

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