MR2A16ACMA35 - Everspin Technologies

MR2A16ACMA35 Details

• Manufacturer Part Number:

  MR2A16ACMA35

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  BGA

• Package Description:

  8 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, FBGA-48

• Pin Count:

  48

• Country Of Origin:

  Taiwan

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.71

• Manufacturer:

  Everspin Technologies

• Access Time-Max:

  35 ns

• JESD-30 Code:

  S-PBGA-B48

• Length:

  8 mm

• Memory Density:

  4194304 bit

• Memory IC Type:

  MEMORY CIRCUIT

• Memory Width:

  16

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  48

• Number of Words:

  262144 words

• Number of Words Code:

  256000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  256KX16

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA48,6X8,30

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.35 mm

• Standby Current-Max:

  0.028 A

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  3 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  0.75 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  8 mm