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MR856RLG - onsemi

Description: Obsolete - Power Rectifier, Standard Recovery, 1 A, 400 V

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PCB Footprints
MR856RLG - onsemi PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - AXIAL-LEAD-CASE 267-05
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3D Models
MR856RLG - onsemi  - 3D model - Diodes, Axial Diameter Horizontal Mounting - AXIAL-LEAD-CASE 267-05
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MR856RLG Details

  • Manufacturer Part Number:

    MR856RLG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    Axial Lead 9.65x5.33mm, 25.4x1.22mm Pkg, Lead len/dia

  • Pin Count:

    2

  • Manufacturer Package Code:

    267-05

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JEDEC-95 Code:

    DO-201AD

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    300 µA

  • Reverse Recovery Time-Max:

    0.3 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

MR856RLG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Use a heat sink with a thermal interface material, ensure good airflow, and consider derating the device's power dissipation at high temperatures (above 125°C).
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling. Place the capacitor close to the device's input pins.
  • Use a shielded inductor, keep the layout compact, and minimize loop areas. Add a common-mode choke or ferrite bead to the output if necessary.
  • The maximum allowed voltage on the enable pin (EN) is 6V. Do not exceed this voltage to prevent damage to the device.

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This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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MR856RLG Overview

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