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MRF136 - MACOM

Description: FET RF 65V 400MHZ 211-07

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MRF136 Details

  • Manufacturer Part Number:

    MRF136

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CASE 211-07, 4 PIN

  • Pin Count:

    4

  • Manufacturer Package Code:

    CASE 211-07

  • ECCN Code:

    EAR99

  • Manufacturer:

    MACOM

  • YTEOL:

    6.85

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    65 V

  • Drain Current-Max (ID):

    2.5 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JESD-30 Code:

    O-CRFM-F4

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    200 °C

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Shape:

    ROUND

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    55 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    FLAT

  • Terminal Position:

    RADIAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

MRF136 Frequently Asked Questions (FAQs)

  • The maximum SOA for the MRF136 is typically defined by the voltage and current ratings, but it's essential to consult the application notes and MACOM's support team for specific guidance on SOA to ensure reliable operation.
  • To optimize thermal performance, ensure proper heat sinking, use a thermally conductive interface material, and follow MACOM's recommended thermal design guidelines. Additionally, consider using a heat sink with a thermal resistance of 1°C/W or lower.
  • Follow MACOM's recommended PCB layout guidelines, which typically include using a solid ground plane, minimizing lead lengths, and using a low-inductance layout. A good grounding scheme is essential to minimize electromagnetic interference (EMI) and ensure stable operation.
  • To minimize parasitic effects, use a low-inductance layout, add decoupling capacitors, and consider using a pi-filter or other EMI-reducing techniques. Additionally, consult MACOM's application notes for specific guidance on managing parasitic effects.
  • Consult MACOM's datasheet and application notes for recommended drive and biasing conditions, which typically include voltage and current limits, as well as guidance on setting the optimal quiescent current (IQ) and voltage (VCE).

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MRF136 Overview

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For a full list of alternate parts for MRF136, check out Findchips.com