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MRFG35003N6AT1 - NXP

Description: RF JFET Transistors 3.5GHZ 3W 6V GAAS PLD1.5

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Symbol
MRFG35003N6AT1 - NXP - PCB symbol
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PCB Footprints
MRFG35003N6AT1 - NXP PCB footprint - Other - Other - MRFG35003N6AT1-2
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3D Models
MRFG35003N6AT1 - NXP - 3D model - Other - MRFG35003N6AT1-2
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MRFG35003N6AT1 Details

  • Manufacturer Part Number:

    MRFG35003N6AT1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, PLASTIC, PLD-1.5, CASE 466-03, 4 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Case Connection:

    SOURCE

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    8 V

  • FET Technology:

    HIGH ELECTRON MOBILITY

  • Highest Frequency Band:

    C BAND

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    GALLIUM ARSENIDE

MRFG35003N6AT1 Frequently Asked Questions (FAQs)

  • A good PCB layout should ensure minimal thermal resistance, use thermal vias, and keep the device away from heat sources. A heat sink or thermal pad can be used to dissipate heat. Consult the NXP application note AN11542 for more information.
  • To minimize power consumption, use the lowest possible supply voltage, reduce the operating frequency, and enable the power-saving features like the 'Low Power Mode' and 'Doze Mode'. Also, consider using a DC-DC converter to reduce power losses.
  • The internal voltage regulator can be configured using the VREG_CTRL register. A typical setting is to enable the internal voltage regulator, set the voltage to 1.2V, and configure the voltage regulator in 'Low Power Mode' to minimize power consumption.
  • To troubleshoot RF performance issues, check the PCB layout, ensure proper impedance matching, and verify the device's configuration and calibration. Use tools like a spectrum analyzer or a vector network analyzer to measure the device's RF performance.
  • When using the device in a harsh environment, consider the operating temperature range, humidity, and vibration. Ensure the device is properly packaged, and the PCB is designed to withstand the environmental stresses. Consult the NXP application note AN11543 for more information.

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MRFG35003N6AT1 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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