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MSB1218A-RT1G - onsemi

Description: Available in 8 mm, 7-inch/3000 Unit Tape and Reel; Low VCE(sat), < 0.5 V; High hFE, 210-460; Pb-Free Package is Available

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PCB Footprints
MSB1218A-RT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-70 (SOT-323)
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MSB1218A-RT1G - onsemi  - 3D model - SOT23 (3-Pin) - SC-70 (SOT-323)
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MSB1218A-RT1G Details

  • Manufacturer Part Number:

    MSB1218A-RT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70 (SOT-323) 3 LEAD

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, CASE 419-04, SC-70, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    419-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    45 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    210

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.15 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

  • VCEsat-Max:

    0.5 V

MSB1218A-RT1G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal management system to keep the device within its operating temperature range.
  • The recommended soldering conditions for the MSB1218A-RT1G are a peak temperature of 260°C, a soldering time of 10 seconds or less, and a soldering method that follows the IPC J-STD-020 standard.
  • To handle ESD protection during handling and assembly, use an ESD wrist strap or mat, handle the device by the body or pins, avoid touching the pins or die, and store the device in an ESD-protective package or bag.
  • The recommended storage conditions for the MSB1218A-RT1G are a temperature range of -40°C to 125°C, a humidity level of 60% or less, and storage in an ESD-protective package or bag.

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MSB1218A-RT1G Overview

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