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MSB92WT1G - onsemi

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MSB92WT1G - onsemi - PCB symbol
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PCB Footprints
MSB92WT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-70 (SOT-323) CASE419-04 ISSUE N
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3D Models
MSB92WT1G - onsemi - 3D model - SOT23 (3-Pin) - SC-70 (SOT-323) CASE419-04 ISSUE N
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MSB92WT1G Details

  • Manufacturer Part Number:

    MSB92WT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70 (SOT-323) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    419-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.5 A

  • Collector-Emitter Voltage-Max:

    300 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    25

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.15 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    50 MHz

MSB92WT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a thermal management system, such as a heat sink or fan, to maintain a junction temperature (Tj) below 150°C. Monitor the device's thermal resistance (RθJA) and adjust the system design accordingly.
  • Use X7R or X5R ceramic capacitors with a minimum capacitance of 10uF and a maximum ESR of 100mΩ for input and output filtering. Ensure the capacitors are placed close to the device's power pins.
  • Use a shielded enclosure, keep the device away from antennas and high-frequency components, and implement a common-mode choke or ferrite bead on the input lines to reduce EMI emissions.
  • Apply the input voltage (VIN) first, followed by the enable signal (EN). Ensure the input voltage is stable before applying the enable signal to prevent unwanted startup behavior.

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MSB92WT1G Overview

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