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MSC050SDA070BCT - Microchip

Description: SiC Schottky Diodes SIC SBD 700 V 50 A TO-247 Voltage - DC Reverse (Vr) (Max) 700 V Current - Average Rectified (Io) 88A Voltage - Forward (Vf) (Max) @ If 1.8 V @ 50 A

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PCB Footprints
MSC050SDA070BCT - Microchip PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247
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3D Models
MSC050SDA070BCT - Microchip  - 3D model - Transistor Outline, Vertical - TO-247
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MSC050SDA070BCT Details

  • Manufacturer Part Number:

    MSC050SDA070BCT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-247-3

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Additional Feature:

    HIGH RELIABILITY, FREE WHEELING DIODE, LOW NOISE, LOW LEAKAGE CURRENT, SNUBBER DIODE

  • Application:

    HIGH VOLTAGE POWER

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    124 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    44 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    283 W

  • Rep Pk Reverse Voltage-Max:

    700 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    700 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

MSC050SDA070BCT Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias under the device. Additionally, ensure that the decoupling capacitors are placed close to the device and connected to the power pins.
  • The MSC050SDA070BCT has a maximum junction temperature of 150°C. To manage thermal performance, ensure good airflow, use a heat sink if necessary, and follow Microchip's thermal design guidelines. You can also use thermal simulation tools to optimize your design.
  • The datasheet recommends using X5R or X7R ceramic capacitors with a minimum capacitance of 10uF for the input and output. The capacitor selection should be based on the specific application requirements, such as voltage rating, ESR, and ripple current. Consult the capacitor manufacturer's datasheet for specific recommendations.
  • To ensure EMC, follow good design practices, such as using a shielded enclosure, minimizing loop areas, and using filtering components. Additionally, ensure that the device is properly decoupled, and the PCB layout is optimized for minimal radiation. Consult the Microchip EMC guidelines and relevant industry standards for more information.
  • The MSC050SDA070BCT has a recommended input voltage range of 4.5V to 5.5V, and the maximum input current is 1.5A. Ensure that the input voltage and current are within the specified range to prevent damage to the device. Consult the datasheet for specific recommendations on input voltage and current derating.

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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