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MSC080SMA120B - Microsemi Corporation

Description: Trans MOSFET N-CH SiC 1.2KV 30A 3-Pin(3+Tab) TO-247 Tube

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MSC080SMA120B - Microsemi Corporation - PCB symbol
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PCB Footprints
MSC080SMA120B - Microsemi Corporation PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247_2
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3D Models
MSC080SMA120B - Microsemi Corporation - 3D model - Transistor Outline, Vertical - TO-247_2
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MSC080SMA120B Details

  • Manufacturer Part Number:

    MSC080SMA120B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    TO-247, 3 PIN

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2018-06-07

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    1200 V

  • Drain Current-Max (ID):

    37 A

  • Drain-source On Resistance-Max:

    0.1 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    200 W

  • Pulsed Drain Current-Max (IDM):

    91 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

MSC080SMA120B Frequently Asked Questions (FAQs)

  • Microsemi recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the device should be connected to a thermal plane or a heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves, ensure good thermal management, and consider using a heat sink or thermal interface material.
  • The MSC080SMA120B has built-in ESD protection, but it's still important to follow standard ESD handling precautions, such as using an ESD wrist strap, mat, or workstation, and storing the devices in anti-static packaging.
  • The MSC080SMA120B is not specifically designed or tested for radiation hardness, but Microsemi offers other products that are radiation-hardened. Consult with Microsemi's sales team or application engineers for guidance on radiation-hardened alternatives.
  • Microsemi recommends using a reflow soldering process with a peak temperature of 260°C (500°F) and a soldering time of 10-30 seconds. Hand soldering is not recommended due to the device's small size and high pin count.

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