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MSC1200Y3PFBT - Texas Instruments

Description: 8051 CPU with 8kB Memory, 24-Bit ADC, Current DAC, and On-Chip Oscillator

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MSC1200Y3PFBT - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PFB (S-PQFP-G48) PLASTIC QUAD FLATPACK
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MSC1200Y3PFBT - Texas Instruments  - 3D model - Quad Flat Packages - PFB (S-PQFP-G48) PLASTIC QUAD FLATPACK
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MSC1200Y3PFBT Details

  • Manufacturer Part Number:

    MSC1200Y3PFBT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    GREEN, PLASTIC, TQFP-48

  • Pin Count:

    48

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.15

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES AT 2.7V SUPPLY

  • Bit Size:

    8

  • Boundary Scan:

    YES

  • CPU Family:

    8051

  • Clock Frequency-Max:

    33 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of I/O Lines:

    16

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    48

  • Number of Timers:

    3

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP48,.35SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    128

  • ROM (words):

    8192

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    33 MHz

  • Supply Current-Max:

    110 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

MSC1200Y3PFBT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias under the device is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using thermal management techniques such as heat sinks or thermal interfaces.
  • At high frequencies, the device's output impedance increases, which can affect the accuracy of the output voltage. Additionally, high-frequency operation can increase power consumption and heat generation. Ensure that the device is properly decoupled and that the PCB is designed to minimize electromagnetic interference (EMI).
  • Use a multi-layer PCB with a solid ground plane, and ensure that the device is properly decoupled using capacitors and resistors. Also, consider using shielding or EMI filters to reduce radiation and conduction.
  • Using a non-recommended capacitor type or value can affect the stability and accuracy of the output voltage. Ensure that the capacitor meets the recommended specifications, and consider using a capacitor with a low equivalent series resistance (ESR) to minimize output voltage ripple.

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MSC1200Y3PFBT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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