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MSC2712GT1G - onsemi

Description: Moisture Sensitivity Level: 1; ESD Rating: TBD; Pb-Free Packages are Available

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MSC2712GT1G - onsemi - PCB symbol
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PCB Footprints
MSC2712GT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-59 CASE 318D-04
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3D Models
MSC2712GT1G - onsemi - 3D model - SOT23 (3-Pin) - SC-59 CASE 318D-04
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MSC2712GT1G Details

  • Manufacturer Part Number:

    MSC2712GT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-59 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    200

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    50 MHz

MSC2712GT1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal via array under the package is recommended. The thermal pad should be connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Avoid overheating the device, as it can lead to reduced reliability and lifespan.
  • The MSC2712GT1G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the MSC2712GT1G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q100 and is PPAP capable. However, it's essential to follow the recommended operating conditions and design guidelines to ensure reliable operation.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check the power supply voltage and ensure it's within the recommended range. Verify that the device is properly soldered and that there are no soldering defects. Consult the datasheet and application notes for troubleshooting guidelines.

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MSC2712GT1G Overview

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