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MSC2X51SDA120J - Microchip

Description: Discrete Semiconductor Modules SIC SBD 1200 V 50 A Dual Parallel SOT-227

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MSC2X51SDA120J Details

  • Manufacturer Part Number:

    MSC2X51SDA120J

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT-227-4

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Additional Feature:

    LOW LEAKAGE CURRENT, FREE WHEELING DIODE, SNUBBER DIODE

  • Application:

    HIGH VOLTAGE

  • Case Connection:

    ISOLATED

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JESD-30 Code:

    R-PUFM-X4

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    50 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

MSC2X51SDA120J Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the MSC2X51SDA120J is 1.14V to 1.26V.
  • To ensure reliability, it is recommended to follow a controlled power-up and power-down sequence, with a ramp-up time of at least 1ms and a ramp-down time of at least 1ms, to prevent voltage drops and ensure proper device operation.
  • The maximum operating frequency of the MSC2X51SDA120J is 1200 MHz.
  • To handle thermal management, it is recommended to use a heat sink or thermal pad to dissipate heat, and to ensure good airflow around the device. The maximum junction temperature (TJ) should not exceed 150°C.
  • The MSC2X51SDA120J comes in a 324-ball Flip Chip Ball Grid Array (FCBGA) package, with a size of 17mm x 17mm.

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MSC2X51SDA120J Overview

Use the download button to access the MSC2X51SDA120J 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like MSC2X, or try a keyword search, such as Rectifier Diodes

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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