MSCSM120AM03CT6LIAG - Microsemi Corporation

MSCSM120AM03CT6LIAG Details

• Manufacturer Part Number:

  MSCSM120AM03CT6LIAG

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Transferred

• Package Description:

  MODULE-11

• ECCN Code:

  EAR99

• Date Of Intro:

  2020-01-30

• Manufacturer:

  Microsemi Corporation (now Microchip)

• Case Connection:

  ISOLATED

• Configuration:

  SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

• DS Breakdown Voltage-Min:

  1200 V

• Drain Current-Max (ID):

  805 A

• Drain-source On Resistance-Max:

  0.0031 Ω

• FET Technology:

  METAL-OXIDE SEMICONDUCTOR

• JESD-30 Code:

  R-XUFM-X11

• Number of Elements:

  2

• Number of Terminals:

  11

• Operating Mode:

  ENHANCEMENT MODE

• Operating Temperature-Max:

  150 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  UNSPECIFIED

• Package Shape:

  RECTANGULAR

• Package Style:

  FLANGE MOUNT

• Polarity/Channel Type:

  N-CHANNEL

• Power Dissipation-Max (Abs):

  3215 W

• Pulsed Drain Current-Max (IDM):

  1600 A

• Surface Mount:

  NO

• Terminal Form:

  UNSPECIFIED

• Terminal Position:

  UPPER

• Transistor Application:

  SWITCHING

• Transistor Element Material:

  SILICON CARBIDE