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MSCSM120HM16CT3AG - Microchip

Description: PM-MOSFET-SIC-SBD~-SP3F

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MSCSM120HM16CT3AG - Microchip PCB footprint - Other - Other - MSCSM120HM16CT3AG-2
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MSCSM120HM16CT3AG - Microchip  - 3D model - Other - MSCSM120HM16CT3AG-2
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MSCSM120HM16CT3AG Details

  • Manufacturer Part Number:

    MSCSM120HM16CT3AG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MODULE-25

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.50.00.80

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

  • DS Breakdown Voltage-Min:

    1200 V

  • Drain Current-Max (ID):

    173 A

  • Drain-source On Resistance-Max:

    0.016 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-XUFM-X25

  • Number of Elements:

    4

  • Number of Terminals:

    25

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    745 W

  • Pulsed Drain Current-Max (IDM):

    350 A

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

MSCSM120HM16CT3AG Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad on the bottom of the package, connected to a solid copper plane on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal plane.
  • To ensure reliable operation, follow the recommended operating conditions, including voltage, current, and temperature ranges. Also, consider derating the device's performance at higher temperatures and using thermal management techniques to keep the junction temperature below 125°C.
  • The MSCSM120HM16CT3AG has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment.
  • While the MSCSM120HM16CT3AG is a high-quality device, it may not meet the specific requirements of high-reliability or aerospace applications. Microchip offers other devices that are specifically designed and qualified for these markets, such as the QTP or Hi-Rel product lines.
  • To troubleshoot issues with the internal oscillator, check the oscillator circuitry for proper connections and component values. Ensure that the oscillator pins are not loaded with excessive capacitance, and verify that the oscillator frequency is within the specified range. If issues persist, consult Microchip's application notes and technical support resources.

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MSCSM120HM16CT3AG Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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