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MSCSM120HRM052NG - Microchip

Description: 1200V, 4.2 mOhm, SP6C, T-Type mSiC® MOSFET Module

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MSCSM120HRM052NG - Microchip  - 3D model
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MSCSM120HRM052NG Details

  • Manufacturer Part Number:

    MSCSM120HRM052NG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MODULE-13

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Case Connection:

    ISOLATED

  • Configuration:

    COMPLEX

  • DS Breakdown Voltage-Min:

    1200 V

  • Drain Current-Max (ID):

    472 A

  • Drain-source On Resistance-Max:

    0.0052 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    150 pF

  • JESD-30 Code:

    R-XUFM-X13

  • Number of Elements:

    4

  • Number of Terminals:

    13

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    940 A

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

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MSCSM120HRM052NG Overview

Use the download button to access the MSCSM120HRM052NG 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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