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MSCSM70DUM017AG - Microchip

Description: Discrete Semiconductor Modules PM-MOSFET-SIC-SP6C

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MSCSM70DUM017AG Details

  • Manufacturer Part Number:

    MSCSM70DUM017AG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MODULE-7

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    22

  • Case Connection:

    ISOLATED

  • Configuration:

    COMMON SOURCE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    700 V

  • Drain Current-Max (ID):

    1021 A

  • Drain-source On Resistance-Max:

    0.0021 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    260 pF

  • JESD-30 Code:

    R-XUFM-X7

  • Number of Elements:

    2

  • Number of Terminals:

    7

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    2000 A

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

MSCSM70DUM017AG Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using thermal interface materials (TIMs) to improve heat transfer between the device and the heat sink or PCB. Operating the device within its specified temperature range and providing adequate cooling will also help ensure reliable operation.
  • Microchip recommends following the JEDEC J-STD-020D.1 standard for soldering conditions. The recommended peak temperature is 260°C, with a maximum time above 217°C of 60 seconds. It's essential to follow these guidelines to prevent damage to the device during the soldering process.
  • To prevent electrostatic discharge (ESD) damage, handle the device by the body or pins, and avoid touching the pins or leads. Use an ESD wrist strap or mat, and ensure that the workspace and equipment are ESD-protected. Follow proper ESD handling procedures during assembly, testing, and storage.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 125°C, and the relative humidity should be below 60%. Avoid storing the device in environments with high levels of pollution, corrosive gases, or radiation.

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MSCSM70DUM017AG Overview

Use the download button to access the MSCSM70DUM017AG 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like MSCSM, or try a keyword search, such as Power Field-Effect Transistors

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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