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MSP3V3HM3/89A - Vishay

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MSP3V3HM3/89A Details

  • Manufacturer Part Number:

    MSP3V3HM3/89A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMP, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Breakdown Voltage-Min:

    4.1 V

  • Breakdown Voltage-Nom:

    4.1 V

  • Clamping Voltage-Max:

    11 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    100 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MSP3V3HM3/89A Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the MSP3V3HM3/89A is a rectangular pad with a size of 3.3 mm x 2.5 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
  • To handle thermal considerations, ensure good thermal conductivity between the device and the PCB, use thermal vias, and consider using a thermal pad or heat sink if high power dissipation is expected.
  • The recommended soldering profile for the MSP3V3HM3/89A is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C, and a cooling rate of 4°C/s or less.
  • Yes, the MSP3V3HM3/89A is suitable for high-reliability applications, as it is built with high-reliability materials and manufacturing processes, and is qualified to various industry standards such as AEC-Q101 and MIL-PRF-19500.
  • To ensure optimal performance, ensure the MSP3V3HM3/89A is biased within the recommended operating conditions, with a stable input voltage, and proper decoupling and filtering to minimize noise and ripple.

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MSP3V3HM3/89A Overview

Use the download button to access the MSP3V3HM3/89A 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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