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MSP430F2112IRHBT - Texas Instruments

Description: Texas Instruments MSP430F2112IRHBT, 16bit MSP430 Microcontroller, 16MHz, 2 kB Flash, 32-Pin VQFN

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PCB Footprints
MSP430F2112IRHBT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RHB0032E_2021
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3D Models
MSP430F2112IRHBT - Texas Instruments  - 3D model - Quad Flat No-Lead - RHB0032E_2021
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MSP430F2112IRHBT Details

  • Manufacturer Part Number:

    MSP430F2112IRHBT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    32

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES AT 1.8 V AT 6 MHZ

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of I/O Lines:

    24

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    32

  • Number of Timers:

    2

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    256

  • RAM (words):

    0.25

  • ROM (words):

    2048

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    16 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSP430F2112IRHBT Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MSP430F2112IRHBT is -40°C to 85°C.
  • To configure the MSP430F2112IRHBT for low-power operation, you can use the Power Management Module (PMM) to control the power modes, such as LPM3 (Low Power Mode 3) or LPM4 (Low Power Mode 4). You can also use the Dynamic Voltage Scaling (DVS) feature to adjust the voltage and frequency of the device based on the application requirements.
  • The maximum clock frequency for the MSP430F2112IRHBT is 16 MHz.
  • The USCI module on the MSP430F2112IRHBT can be used for UART, SPI, or I2C communication. You need to configure the USCI module by setting the appropriate registers and using the corresponding APIs in your code. You can refer to the MSP430F2xx Family User's Guide and the device datasheet for more information.
  • The JTAG (Joint Test Action Group) interface on the MSP430F2112IRHBT is used for debugging and programming the device. It allows you to connect a debugger or programmer to the device and perform tasks such as flashing the firmware, debugging code, and monitoring the device's behavior.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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