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MSP430F2618TZQWR - Texas Instruments

Description: 16-Bit Ultra-Low-Power MCU, 116kB Flash, 8KB RAM, 12-Bit ADC, Dual DAC, 2 USCI, HW Mult, DMA

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PCB Footprints
MSP430F2618TZQWR - Texas Instruments PCB footprint - BGA - BGA - ZQW (S-PBGA-N113)
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3D Models
MSP430F2618TZQWR - Texas Instruments  - 3D model - BGA - ZQW (S-PBGA-N113)
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MSP430F2618TZQWR Details

  • Manufacturer Part Number:

    MSP430F2618TZQWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    BGA-113

  • Pin Count:

    113

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PBGA-B113

  • JESD-609 Code:

    e1

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    3

  • Number of I/O Lines:

    64

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    113

  • Number of Timers:

    2

  • On Chip Data RAM Width:

    16

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA113,12X12,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    8192

  • RAM (words):

    4096

  • ROM (words):

    118784

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    16 MHz

  • Supply Current-Max:

    0.595 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSP430F2618TZQWR Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the MSP430F2618 is 16 MHz.
  • The MSP430F2618 has 8KB of flash memory.
  • The operating voltage range of the MSP430F2618 is 1.8V to 3.6V.
  • No, the MSP430F2618 does not have a built-in USB interface.
  • The MSP430F2618 has 16 GPIO pins.

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MSP430F2618TZQWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image MSP430F2618TZQW Texas Instruments

RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 16MHz, CMOS, PBGA113