MSP430F2619TZQW - Texas Instruments

MSP430F2619TZQW Details

• Manufacturer Part Number:

  MSP430F2619TZQW

• Brand Name:

  Texas Instruments

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Package Description:

  BGA-113

• Pin Count:

  113

• ECCN Code:

  EAR99

• HTS Code:

  8542.31.00.01

• Manufacturer:

  Texas Instruments

• YTEOL:

  0

• Has ADC:

  YES

• Additional Feature:

  ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

• Bit Size:

  16

• Boundary Scan:

  YES

• CPU Family:

  MSP430

• Clock Frequency-Max:

  16 MHz

• DAC Channels:

  YES

• DMA Channels:

  YES

• Format:

  FIXED POINT

• Integrated Cache:

  NO

• JESD-30 Code:

  S-PBGA-B113

• JESD-609 Code:

  e1

• Length:

  7 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of DMA Channels:

  3

• Number of I/O Lines:

  64

• Number of Serial I/Os:

  2

• Number of Terminals:

  113

• Number of Timers:

  10

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA113,12X12,20

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (bytes):

  4096

• RAM (words):

  4

• ROM (words):

  122880

• ROM Programmability:

  FLASH

• Seated Height-Max:

  1 mm

• Speed:

  16 MHz

• Supply Current-Max:

  0.595 mA

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  TIN SILVER COPPER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  7 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC