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MSP430F47166IPZ - Texas Instruments

Description: Texas Instruments MSP430F47166IPZ, 16bit MSP430 Microcontroller, 16MHz, 92 kB Flash, 100-Pin LQFP

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MSP430F47166IPZ - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PZ (S-PQFP-G100
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MSP430F47166IPZ - Texas Instruments  - 3D model - Quad Flat Packages - PZ (S-PQFP-G100
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MSP430F47166IPZ Details

  • Manufacturer Part Number:

    MSP430F47166IPZ

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Additional Feature:

    IT ALSO OPERATES 4.15MHZ AT MINI 1.8V

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    3

  • Number of I/O Lines:

    68

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    100

  • Number of Timers:

    7

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    4096

  • RAM (words):

    4

  • ROM (words):

    94208

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    16 MHz

  • Supply Current-Max:

    0.56 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSP430F47166IPZ Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MSP430F47166IPZ is -40°C to 85°C, but it can be extended to -40°C to 105°C with some limitations on the clock frequency and supply voltage.
  • To configure the MSP430F47166IPZ for low-power operation, you can use the Power Management Module (PMM) to control the power modes, such as LPM0, LPM1, LPM2, LPM3, and LPM4. You can also use the Dynamic Voltage Scaling (DVS) feature to adjust the supply voltage based on the clock frequency.
  • The maximum clock frequency for the MSP430F47166IPZ is 8 MHz, but it can be increased to 12 MHz with some limitations on the supply voltage and operating temperature.
  • The MSP430F47166IPZ has a built-in USB interface that can be used for communication and power delivery. To use the USB interface, you need to configure the USB module, implement the USB protocol stack, and use the USB APIs provided by Texas Instruments.
  • The MSP430F47166IPZ has 92 KB of flash memory, but only 88 KB is available for program storage. The remaining 4 KB is reserved for the boot loader and other system functions.

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MSP430F47166IPZ Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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