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MSP430F5229IYFFR - Texas Instruments

Description: MCU 16-bit MSP430 RISC 128KB Flash 2.5V 64-Pin DSBGA T/R

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MSP430F5229IYFFR - Texas Instruments PCB footprint - BGA - BGA - YFF (R-XBGA-N64)
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MSP430F5229IYFFR - Texas Instruments  - 3D model - BGA - YFF (R-XBGA-N64)
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MSP430F5229IYFFR Details

  • Manufacturer Part Number:

    MSP430F5229IYFFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    64

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Additional Feature:

    IT ALSO OPERATES IN 1.8V AT 8MHZ

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PBGA-B64

  • JESD-609 Code:

    e1

  • Length:

    3.535 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of DMA Channels:

    3

  • Number of I/O Lines:

    53

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    64

  • Number of Timers:

    18

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA64,8X8,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    8192

  • RAM (words):

    8

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.625 mm

  • Speed:

    25 MHz

  • Supply Current-Max:

    11 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.415 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSP430F5229IYFFR Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the MSP430F5229IYFFR is 25 MHz, but it can be overclocked to 30 MHz with reduced voltage and temperature range.
  • The internal oscillator on the MSP430F5229IYFFR can be configured using the UCSCTL0, UCSCTL1, and UCSCTL2 registers. The oscillator frequency can be set to 1 MHz, 5 MHz, 10 MHz, or 20 MHz.
  • The maximum current consumption of the MSP430F5229IYFFR is approximately 15 mA at 25 MHz and 3.0 V, but this can vary depending on the operating frequency, voltage, and peripheral usage.
  • The built-in temperature sensor on the MSP430F5229IYFFR can be enabled by setting the TMPEN bit in the SYSCTLTG register. The temperature data can then be read from the TEMPERATURE register.
  • The maximum flash endurance of the MSP430F5229IYFFR is 10,000 write/erase cycles at a temperature range of -40°C to 85°C.

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MSP430F5229IYFFR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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