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Part Image

MSP430F5310IZQE - Texas Instruments

Description: MCU 16-bit MSP430 RISC 32KB Flash 2.5V/3.3V 80-Pin BGA MICROSTAR JUNIOR Tray

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PCB Footprints
MSP430F5310IZQE - Texas Instruments PCB footprint - BGA - BGA - ZQE(S-PBGA-N80)
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3D Models
MSP430F5310IZQE - Texas Instruments  - 3D model - BGA - ZQE(S-PBGA-N80)
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MSP430F5310IZQE Details

  • Manufacturer Part Number:

    MSP430F5310IZQE

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    VFBGA, BGA80,9X9,20

  • Pin Count:

    80

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PBGA-B80

  • JESD-609 Code:

    e1

  • Length:

    5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    3

  • Number of I/O Lines:

    47

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    80

  • Number of Timers:

    18

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA80,9X9,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    6144

  • RAM (words):

    6

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    25 MHz

  • Supply Current-Max:

    6.5 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

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MSP430F5310IZQE Overview

Use the download button to access the MSP430F5310IZQE schematic symbol, PCB footprint, and 3D model.
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Part Image MSP430F5310IZQER Texas Instruments

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Part Image MSP430F5308IZQER Texas Instruments

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Part Image MSP430F5308IZQE Texas Instruments

MSP430F530x Mixed Signal Microcontroller 80-BGA MICROSTAR JUNIOR -40 to 85

Part Image MSP430F5309IZQE Texas Instruments

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For a full list of alternate parts for MSP430F5310IZQE, check out Findchips.com