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MSP430F5508IRGCR - Texas Instruments

Description: MIXED SIGNAL MICROCONTROLLER

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MSP430F5508IRGCR - Texas Instruments PCB footprint - Other - Other - QFN50P900X900X100-65N
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MSP430F5508IRGCR - Texas Instruments  - 3D model - Other - QFN50P900X900X100-65N
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MSP430F5508IRGCR Details

  • Manufacturer Part Number:

    MSP430F5508IRGCR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    3

  • Number of I/O Lines:

    47

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    64

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    4096

  • RAM (words):

    2048

  • ROM (words):

    16384

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    25 MHz

  • Supply Current-Max:

    6.5 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSP430F5508IRGCR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MSP430F5508IRGCR is -40°C to 85°C, as specified in the datasheet. However, it's recommended to operate within the industrial temperature range of -40°C to 70°C for optimal performance and reliability.
  • To configure the MSP430F5508IRGCR for low-power operation, you can use the Power Management Module (PMM) to control the power modes. You can also use the Low Power Mode (LPM) to reduce power consumption. Additionally, you can disable unused peripherals and use the Dynamic Voltage Scaling (DVS) feature to optimize power consumption.
  • The maximum clock frequency for the MSP430F5508IRGCR is 25 MHz, as specified in the datasheet. However, the actual clock frequency may vary depending on the crystal oscillator frequency and the clock divider settings.
  • The MSP430F5508IRGCR can be programmed using the Texas Instruments Code Composer Studio (CCS) integrated development environment (IDE) or the IAR Embedded Workbench. You can also use the MSP430 Flasher tool to program the device.
  • The MSP430F5508IRGCR has 128 KB of flash memory, which can be used to store program code and data.

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MSP430F5508IRGCR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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